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5G mobile phone

release time:2020-05-20 Author: admin

From current 7nm to future 3nm chip process, from the current 5G to the future 6G communication technology, the speed of information processing and transferring are becoming higher and higher, and the data flow are becoming larger and larger. Therefore, the heat generation, power consumption and signal attenuation of components and systems are becoming more and more intense. The computing and communication systems such as mobile phones, base stations and computers need efficient thermal management. Thus, the thermal management materials such as thermal interfacial materials are getting more and more important. A large class of thermal management materials should have high thermal conductivity, low dielectric loss and thermal stability. Aluminum nitride, silicon nitride and boron nitride are the preferred materials for their excellent comprehensive performance.


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