h-AlNp
release time：2020-05-20 Author： admin
h-AlNp is a granular h-AlN material with high thermal conductivity and dielectric strength, low thermal expansion coefficient, dielectric constant and dielectric loss, and excellent high temperature and corrosion resistance. The specific properties of h-AlNp are shown in Table 1.7.
h-AlNp is an excellent electrical insulative high thermal conductive filler for insulative resin and thermal interface materials in the electronic component industry, which can improve the thermal conductivity of thermal grease and silicone pad and its thermal expansion coefficient matching with the chip. It is an excellent raw material of ceramic substrates and components with high thermal conductivity and reliability.
